ZEISS Crossbeam 550 FIB-SEM


SEM for diverse applications

Versatile FIB-SEM

ZEISS Crossbeam 550 combines powerful imaging and analytical SEM with superior processing ability of a focused ion beam (FIB).  

High throughput 3D analysis and sample preparation

ZEISS Crossbeam 550 allows simultaneous modification and monitoring of samples, resulting in fast sample preparation and high throughput, e.g., for cross-sectioning, TEM lamella and atom probe tip preparation, nano-patterning, and 3D tomography with analytics.

SEM capabilities

Good surface and material contrast of materials from materials to TEM thin biological sections.

Analytical capabilities

This microscope has state-of-the-art EDS and EBSD detectors for chemical and crystallographic analysis.

All kinds of research

ZEISS Crossbeam 550 FIB-SEM has widespread applications in metallurgy, ceramics, composites, polymers, geology, arts, biology, pharmaceuticals, forensics, and other disciplines.

Technical specifications

General specifications 
Scanning electron gun 
SEM voltage 0.02-30 kV 
SEM probe intensity 10 pA – 40 nA 
SEM magnification 12- 2,000,000 x 
SEM resolution 1.6 nm at 1 kV 
Focused ion beam gun 
FIB voltage 30 kV 
FIB probe intensity 1pA – 100nA 
FIB magnification 300 – 500,000 x 
FIB resolution 3 nm at 30 kV 
In-Chamber Everhart Thornley SE2 Surface contrast, long range 
In-Lens SE2 Surface contrast, short range 
In-Lens ESB Material contrast 
In-chamber retractable large-area diode-based BSD Material contrast 
In-chamber retractable annular multi-mode aSTEM detector High resolution, surface and material contrast  
Oxford Instrument Ultim Max EDS detector High sensitivity and speed 
Oxford Instrument Ultim Extreme Windowless EDS detector High spatial resolution, 1 to 7 kV 
Oxford Instrument Symmetry S2 EBSD CMOS detector High sensitivity and indexing speed of > 4000 patterns per second (pps) 

Interested in how we can use this instrument for your work?

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